Methods of forming thermoelectric devices using islands of thermoelectric material and related structures

US7679203B2 · kind B2 · utility

Assignee

• Nextreme Thermal Solutions, Inc. · US

Inventors

• Jayesh Bharathan · Lompoc, US
• David A. Koester · Burlington, US
• Randall G. Alley · Raleigh, US
• Rama Venkatasubramanian · Cary, US
• Pratima Addepalli · Saline, US
• Bing W. Shen · Richardson, US
• Cynthia Watkins · Dunn, US

Key dates

• Filing date: Mar 2, 2007
• Grant date: Mar 16, 2010
• Expiry date: Nov 21, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S257/93

Abstract

A method of forming a thermoelectric device may include forming a plurality of islands of thermoelectric material on a deposition substrate. The plurality of islands of thermoelectric material may be bonded to a header substrate so that the plurality of islands are between the deposition substrate and the header substrate. More particularly, the islands of thermoelectric material may be epitaxial islands of thermoelectric material having crystal structures aligned with a crystal structure of the deposition substrate. Related structures are also discussed.