Protection of an integrated circuit and method thereof
US7680622B2 · kind B2 · utility
6Cited by
13References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2005 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jun 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit comprises a power device located on a die. The power device is operably coupled to a processing function, wherein the signal processing function is operably coupled to two or more temperature sensors. A first temperature sensor is operably coupled to the power device to measure a temperature of the power device and the second temperature sensor is located, such that it measures a substantially ambient temperature related to the die. The signal processing function determines the temperature gradient therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.