Patent · US Active

Method of forming an assembly to house one or more micro components

US7681306B2 · kind B2 · utility

5Cited by

22References

29Claims

0Family size

Assignee

Hymite A/S · DK

Inventors

Matthias Heschel · Copenhagen, DK
Arnd Kilian · Berlin, DE

Key dates

Filing date	Apr 28, 2004
Grant date	Mar 23, 2010
Priority date	—
Expiry date	Mar 27, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49169
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

Formation of a structure with through-holes includes attaching two sub-structures to one another. The resulting structure may be used in a sub-assembly for various types of micro components and may serve as a lid or base of a housing that encapsulates one or more micro components. The techniques may provide greater flexibility in the shape of the through-holes and may reduce costs compared with other known techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.