Patent · US Active

Method of machining substrate

US7682224B2 · kind B2 · utility

3Cited by

3References

4Claims

0Family size

Assignee

DISCO CORPORATION · JP

Inventors

Yusuke Kimura · Shinagawa, JP
Toshiharu Daii · Shinagawa, JP
Takashi Mori · Tokyo, JP

Key dates

Filing date	Jun 4, 2008
Grant date	Mar 23, 2010
Priority date	—
Expiry date	Nov 14, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T83/0524
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.