Plating solutions for electroless deposition of ruthenium
US7682431B1 · kind B1 · utility
1Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2008 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Nov 12, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solution is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.