Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components
US7682455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2004 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jul 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68714
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To make possible a tightly packed, essentially horizontal storage of wafers (40), in which a simplified access to each of these wafers (40) is possible, a device is provided having a plurality of superimposed storage elements (10). The storage elements (10) have device features (16) for depositing the wafers (40). The storage elements (10) have projections (14) for lifting, whereby a specific storage element (10a) as well as all storage elements (10) arranged above this specific storage element (10a) can be lifted by a predetermined first height for producing a contact gap. The projections (14) can also be used to lift the storage element (10b) arranged below the said storage element (10a) by a predetermined second height for producing a freedom of access.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.