Transparent member, optical device using transparent member and method of manufacturing optical device
US7682853B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 5, 2006 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Mar 14, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.