Advanced multilayer coreless support structures and method for their fabrication
US7682972B2 · kind B2 · utility
27Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2006 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Feb 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a free standing membrane including via array in a dielectric for use as a precursor in the construction of superior electronic support structures, includes the steps of fabricating a membrane of conductive vias in a dielectric surround on a sacrificial carrier, and detaching the membrane from the sacrificial carrier to form a free standing laminated array. An electronic substrate based on such a free standing membrane may be formed by thinning and planarizing laminated array, followed by terminating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.