Eva Igner
8Patents
7h-index
12Co-inventors
56Inventor score
Filing activity: Apr 8, 1997 → Dec 12, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7669320B2 | Coreless cavity substrates for chip packaging and their fabrication | Emerging Cross-Sectional Technologies | 43 | Active |
| US6280640A | Process for manufacturing a chip carrier substrate | Electricity | 41 | Expired |
| US6262376A | Chip carrier substrate | Electricity | 34 | Expired |
| US7635641B2 | Integrated circuit support structures and their fabrication | Electricity | 33 | Active |
| US7682972B2 | Advanced multilayer coreless support structures and method for their fabrication | Electricity | 27 | Active |
| US6262478A | Electronic interconnect structure and method for manufacturing it | Electricity | 21 | Expired |
| US5946600A | Method for manufacturing an electronic structure | Electricity | 20 | Expired |
| US9603261B2 | Method for improving coating | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.