Low application temperature hot melt adhesive

US7683114B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Charles W. Paul · Madison, US
• Matthew Sharak · Willingboro, US
• Leisa Ryan · Bundaberg, AU
• Maria Xenidou · Flemington, US
• Michael Harwell · Flemington, US
• Qiwei He · Yokohama, JP

Key dates

• Filing date: Mar 12, 2007
• Grant date: Mar 23, 2010
• Expiry date: Mar 12, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T442/2746
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).