Etched leadframe structure including recesses
US7683463B2 · kind B2 · utility
0Cited by
52References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jul 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe structure is disclosed. The leadframe structure includes a first leadframe structure portion with a first thin portion and a first thick portion, where the first thin portion is defined in part by a first recess. It also includes a second leadframe structure portion with a second thin portion and a second thick portion, where the second thin portion is defined in part by a second recess. The first thin portion faces the second recess, and the second thin portion faces the first recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.