Lay Yeap Lim
9Patents
3h-index
17Co-inventors
50Inventor score
Filing activity: Apr 19, 2007 → May 24, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9303327B2 | Electric component with an electrophoretically deposited film | Electricity | 6 | Active |
| US8664752B2 | Semiconductor die package and method for making the same | Emerging Cross-Sectional Technologies | 5 | Active |
| US9263419B2 | Lead frame strips with electrical isolation of die paddles | Electricity | 3 | Active |
| US9252063B2 | Extended contact area for leadframe strip testing | Electricity | 3 | Active |
| US7923301B2 | Etched leadframe structure | Electricity | 2 | Active |
| US9728492B1 | Strip testing of semiconductor devices | Electricity | 2 | Active |
| US8110447B2 | Method of making and designing lead frames for semiconductor packages | Electricity | 0 | Active |
| US9159656B2 | Semiconductor die package and method for making the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US7683463B2 | Etched leadframe structure including recesses | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.