Systems and methods for cooling an electronic device
US7684194B2 · kind B2 · utility
2Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2008 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jun 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.