Photoresist edge bead removal measurement
US7684611B2 · kind B2 · utility
5Cited by
2References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Aug 17, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the wafer to an edge bead removal line about the circumference of the wafer is determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.