Method for manufacturing bump of probe card
US7685704B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2007 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jul 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing a bump of a probe card is disclosed. In accordance with the present invention, the bump has a high aspect ratio, a high elasticity, a high durability suitable for testing a high speed device. The bump is formed using a sacrificial substrate as a mold to have a shape of Π or II for elasticity and durability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.