WILLTECHNOLOGY CO., LTD.
6Patents
6Active
6Granted
55Portfolio score
Filing activity: Jun 8, 2007 → Dec 5, 2022 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7723143B2 | Method for manufacturing cantilever structure of probe card | Physics | 2 | Active |
| US10928422B2 | Semiconductor testing apparatus | Physics | 1 | Active |
| US7685704B2 | Method for manufacturing bump of probe card | Emerging Cross-Sectional Technologies | 0 | Active |
| US7824561B2 | Method for manufacturing probe structure | Physics | 0 | Active |
| US12253542B2 | Needle block for easy adjustment of tip length of needle unit | Physics | 0 | Active |
| US7951302B2 | Method for forming bump of probe card | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.