Patent · US Active

Method of fabricating a probe card

US7685705B2 · kind B2 · utility

1Cited by

58References

9Claims

0Family size

Assignee

Cypress Semiconductor Corporation · US

Inventors

James E. Nulty · San Jose, US
James Hunter · Campbell, US
Alexander Herrera · Colorado Springs, US

Key dates

Filing date	Jan 11, 2008
Grant date	Mar 30, 2010
Priority date	—
Expiry date	Apr 3, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.