Method for bonding substrates and method for irradiating particle beam to be utilized therefor
US7686912B2 · kind B2 · utility
10Cited by
7References
7Claims
0Family size
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Key dates
| Filing date | Aug 27, 2004 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Jun 8, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/14
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.