Semiconductor component comprising interconnected cell strips
US7687912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | May 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component comprises a semiconductor body including a front side and a number of cell strips. Each of the cell strips includes a terminal zone of a first type arranged on the front side of the semiconductor body and a terminal zone of a second type arranged on the front side of the semiconductor body. A patterned first metallization layer, a patterned second metallization layer, and a patterned third metallization layer are arranged successively on the front side. A first plurality of conductive lines are formed in the first metallization layer and a second plurality of conductive lines are formed in the second metallization layer. The second plurality of conductive lines cross the first plurality of conductive lines at crossover locations. The second plurality of conductive lines are electrically conductively connected to the first plurality of conductive lines at predetermined crossover locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.