Method and device for measuring bond energy
US7688946B2 · kind B2 · utility
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1References
18Claims
0Family size
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Key dates
| Filing date | Oct 24, 2005 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Oct 24, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The adhesion between two layers, in particular two thin layers of a microelectronic device, is a data item of importance. It was found that the closure ratio of the interface could be used, in non-destructive manner, to determine a measurement of bond energy. A method and a device using a magnitude characteristic of this length are described, in particular using low incidence X-ray reflection and electronic density at the interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.