Hubert Moriceau
83Patents
15h-index
91Co-inventors
87Inventor score
Filing activity: Sep 24, 1980 → Dec 19, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6756286B1 | Method for transferring a thin film comprising a step of generating inclusions | Emerging Cross-Sectional Technologies | 163 | Expired |
| US6809044B1 | Method for making a thin film using pressurization | Emerging Cross-Sectional Technologies | 121 | Expired |
| US6204079A | Selective transfer of elements from one support to another support | Electricity | 60 | Expired |
| US6756285B1 | Multilayer structure with controlled internal stresses and making same | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6403450B1 | Heat treatment method for semiconductor substrates | Electricity | 43 | Expired |
| US7902038B2 | Detachable substrate with controlled mechanical strength and method of producing same | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6974759B2 | Method for making a stacked comprising a thin film adhering to a target substrate | Electricity | 30 | Expired |
| US7713369B2 | Detachable substrate or detachable structure and method for the production thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6991995B2 | Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer | Electricity | 29 | Expired |
| US6821376B1 | Method for separating two elements and a device therefor | Emerging Cross-Sectional Technologies | 26 | Expired |
| US7232739B2 | Multifunctional metallic bonding | Electricity | 23 | Active |
| US7494897B2 | Method of producing mixed substrates and structure thus obtained | Electricity | 17 | Expired |
| US7407867B2 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Emerging Cross-Sectional Technologies | 17 | Active |
| US7579259B2 | Simplified method of producing an epitaxially grown structure | Electricity | 17 | Active |
| US7229899B2 | Process for the transfer of a thin film | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6808967B1 | Method for producing a buried layer of material in another material | Electricity | 15 | Expired |
| US6724017B2 | Method for automatic organization of microstructures or nanostructures and related device obtained | Chemistry; Metallurgy | 15 | Expired |
| US8318586B2 | Nitrogen-plasma surface treatment in a direct bonding method | Electricity | 14 | Active |
| US7883994B2 | Process for the transfer of a thin film | Emerging Cross-Sectional Technologies | 12 | Active |
| US7781300B2 | Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas | Electricity | 10 | Expired |
| US7268060B2 | Method for fabricating a substrate with useful layer on high resistivity support | Electricity | 10 | Expired |
| US7258743B2 | Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7541263B2 | Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized | Electricity | 6 | Expired |
| US8288250B2 | Method for transferring chips onto a substrate | Electricity | 6 | Active |
| US7115481B2 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Emerging Cross-Sectional Technologies | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.