Pattern transferring mold, pattern transferring apparatus and device manufacturing method using the same
US7690912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Jan 21, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/036
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
One object of the present invention is to provide a pattern transferring mold which can provide a starting area of mold release easily and certainly and a pattern transferring apparatus with the same. A pattern transferring mold is disclosed which is used in a pattern transferring apparatus that brings the mold into contact with a photo-curing resin on a substrate and cures the photo-curing resin by light irradiation to transfer a pattern formed on the mold onto the photo-curing resin. The mold comprises a bottom face which contacts the photo-curing resin, the bottom face portion including a first area in which the pattern is formed and a second area formed outside the first area. The mold has a mold-releasing shape in the second area, the mold-releasing shape providing a starting area of mold release from the cured photo-curing resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.