Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization
US7691287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2007 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Nov 14, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/044
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of polishing a substrate with a polishing composition comprising an oxidizing agent and abrasive particles having a surface, said surface of the abrasive particles being at least partially modified with 1) at least one stabilizer compound comprising aluminum, boron, tungsten, or both, said stabilizer compound being bound via a covalent bond to said abrasive particles, and 2) an organic chelating compound, said chelating compound being bound via a covalent bond to said stabilizer compound. The organic chelating compounds include one or more of 1) a nitrogen-containing moiety and between one and five other polar groups; 2) a sulfur-containing moiety and between one and five other polar groups; and 3) between two and five polar groups selected from carboxylic acid groups or salts thereof and hydroxyl groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.