Heat slug and semiconductor package
US7692290B2 · kind B2 · utility
2Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2008 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Oct 21, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat slug includes a heat spreading member and a supporting member. The supporting member extends outwardly from the edge of the heat spreading member. The tips of the supporting member are formed with a plurality of contact portions, wherein each said contact portion has a bottom face inclined to the surface of the chip carrier art an angle of more that 5 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.