Compliant structure for an electronic device, method of manufacturing same, and system containing same
US7692307B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Dec 8, 2006 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Apr 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.