Patent · US Active

Apparatus for housing a micromechanical structure

US7692317B2 · kind B2 · utility

4Cited by

15References

2Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Martin Franosch · Munich, DE
Andreas Meckes · Munich, DE
Winfried Nessler · Munich, DE
Klaus-Gunter Oppermann · Holzkirchen, DE

Key dates

Filing date	Sep 28, 2007
Grant date	Apr 6, 2010
Priority date	—
Expiry date	Sep 28, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/977
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.