Probe card substrate with bonded via
US7692436B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2008 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Mar 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.