Patent · US Active

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

US7692588B2 · kind B2 · utility

26Cited by

6References

34Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gottfried Beer · Nittendorf, DE
Christoph Kienmayer · Unterhaching, DE
Klaus Pressel · Regensburg, DE
Werner Simbuerger · Haar, DE

Key dates

Filing date	Jun 1, 2006
Grant date	Apr 6, 2010
Priority date	—
Expiry date	Oct 24, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.