Lithography projection objective, and a method for correcting image defects of the same
US7692868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2008 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Nov 5, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7015
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Projection objectives, as well as related components, systems and methods, are disclosed. In general, a projection objective is configured to image radiation from an object plane to an image plane. A projection objective can include a plurality of optical elements along the optical axis. The plurality of optical elements can include a group of optical elements and a last optical element which is closest to the image plane, and a positioning device configured to move the last optical element relative to the image plane. Typically, a projection objective is configured to be used in a microlithography projection exposure machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.