Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips
US7696015B2 · kind B2 · utility
13Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jan 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.