Method for producing an electrical contact for an optoelectronic semiconductor chip

US7696078B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Wilhelm Stein · Dresden, DE
• Michael Fehrer · Bad Abbach, DE
• Johannes Baur · Regensburg, DE
• Matthias Winter · Regensburg, DE
• Andreas Ploessl · Regensburg, DE
• Stephan Kaiser · Regensburg, DE
• Berthold Hahn · Hemau, DE
• Franz Eberhard · Kilchberg, CH

Key dates

• Filing date: Jan 16, 2007
• Grant date: Apr 13, 2010
• Expiry date: Jul 3, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/825

Abstract

A method for producing an electrical contact of an optoelectronic semiconductor chip (1), comprising providing a mirror layer (2), comprised of a metal or metal alloy, over the semiconductor chip; providing a protective layer (3) over said mirror layer; providing a layer sequence of a barrier layer and a coupling layer (5) over said protective layer; and providing a solder layer (8) over said layer sequence.