Surface mounting device-type light emitting diode
US7696525B2 · kind B2 · utility
4Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2007 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Apr 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.