Patent · US Active

CMP porous pad with component-filled pores

US7699684B2 · kind B2 · utility

35Cited by
23References
11Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 26, 2007
Grant dateApr 20, 2010
Priority date—
Expiry dateApr 25, 2027

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24D3/32
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.