Patent · US Active

Method for fabricating an integrated device comprising a structure with a solid electrolyte

US7700398B2 · kind B2 · utility

3Cited by

3References

28Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Cay-Uwe Pinnow · Birkenfeld, DE

Key dates

Filing date	Aug 5, 2005
Grant date	Apr 20, 2010
Priority date	—
Expiry date	Jun 27, 2028

Classification

Technology area (CPC G)Physics
CPC primaryG11C13/0011
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Method for fabricating an integrated device, comprising the step of providing a substrate, which includes an electrode element, and a step of providing a solid electrolyte element coupled to the electrode element. The solid electrolyte element is provided in a crystalline state and in conjunction with electrode element such to form a programmable resistance element. The method furthermore comprises a heating process, after providing the solid electrolyte element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.