Large die package structures and fabrication method therefor
US7700404B2 · kind B2 · utility
15Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2006 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Aug 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.