Recycling of ion implantation monitor wafers

US7700488B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Steven R. Codding · Underhill, US
• Joseph R. Greco · South Burlington, US
• Timothy C. Krywanczyk · South Burlington, US

Key dates

• Filing date: Jan 16, 2007
• Grant date: Apr 20, 2010
• Expiry date: Jun 17, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02013
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A wafer processing method. The method includes providing a semiconductor wafer. The semiconductor wafer includes (i) a semiconductor layer and (ii) a dopant layer on top of the semiconductor layer. The dopant layer comprises dopants. The method further includes removing the dopant layer from the semiconductor wafer. No chemical etching is performed on the dopant layer before said removing the dopant layer is performed.