Rotational positioner and methods for semiconductor wafer test systems
US7701232B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2007 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | May 7, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor wafer prober is configured to rotate a semiconductor wafer into relative alignment with a wafer-interface probe adapted to simultaneously probe a number of integrated circuits within a sector of the semiconductor wafer. The wafer can include integrated circuits having different orientations, such that all of the integrated circuits within a given sector being tested have the same orientation. For example, a semiconductor wafer can include two semicircular sectors, with the integrated circuits on either sector having a common orientation rotated 180 degrees from a common orientation of the integrated circuits of the other sector. A wafer-interface probe, or probe card, adapted to test the entire semicircular sector during a single touch down is able to test the entire wafer with one rotational translation between testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.