Active thermal control using a burn-in socket heating element
US7701238B2 · kind B2 · utility
4Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2007 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Dec 14, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.