Electronic circuit package
US7701743B2 · kind B2 · utility
0Cited by
68References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2008 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Aug 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.