Tetsuya Okishima
12Patents
6h-index
9Co-inventors
59Inventor score
Filing activity: Mar 31, 1987 → Aug 7, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6223273A | Electronic circuit package | Electricity | 23 | Expired |
| US5468992A | Electronic circuit package including plural bare chips mounted on a single wiring substrate | Electricity | 18 | Expired |
| US5789805A | Semiconductor multi-chip module | Electricity | 12 | Expired |
| US5614761A | Electronic circuit package including plural semiconductor chips formed on a wiring substrate | Electricity | 11 | Expired |
| US6728904B2 | Electronic circuit package | Electricity | 11 | Expired |
| US6584004B2 | Electronic circuit package | Electricity | 10 | Expired |
| US6195742A | Semiconductor multi-chip module | Electricity | 6 | Expired |
| US7120069B2 | Electronic circuit package | Electricity | 2 | Expired |
| US7425763B2 | Electronic circuit package | Electricity | 2 | Active |
| US7233534B2 | Electronic circuit package | Electricity | 1 | Expired |
| US4842899A | Process for forming metallic film on inorganic material | Electricity | 1 | Expired |
| US7701743B2 | Electronic circuit package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.