Method of manufacture for microelectromechanical devices
US7704772B2 · kind B2 · utility
36Cited by
120References
17Claims
0Family size
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Key dates
| Filing date | Nov 14, 2008 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Nov 14, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12542
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.