MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same
US7704773B2 · kind B2 · utility
12Cited by
59References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2006 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Dec 13, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.