Electronic assemblies with hot spot cooling and methods relating thereto
US7704798B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2008 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Dec 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249921
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.