On-chip heater and methods for fabrication thereof and use thereof
US7704847B2 · kind B2 · utility
8Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2006 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Jun 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.