Patent · US Active

Semiconductor module

US7705441B2 · kind B2 · utility

0Cited by

5References

40Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Reimund Engl · Munich, DE
Thomas Behrens · Madison, US

Key dates

Filing date	Mar 6, 2007
Grant date	Apr 27, 2010
Priority date	—
Expiry date	Jul 4, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module is disclosed. One embodiment provides a first semiconductor chip, a second semiconductor chip and a spacer. The first semiconductor chip has a depression at a first main surface. The spacer applied to the first main surface and at least partly fills the depression. The second semiconductor chip is applied to the spacer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.