Cooling apparatus for memory module
US7705449B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2006 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Oct 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.