Hee Jin Lee
47Patents
7h-index
79Co-inventors
72Inventor score
Filing activity: Apr 2, 1986 → Aug 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5571395A | Breath alcohol analyzer using a biosensor | Emerging Cross-Sectional Technologies | 348 | Expired |
| US6542506B1 | Method of transferring data between networks | Electricity | 53 | Expired |
| US5656142A | Biosensor for measuring gas and the manufacturing method thereof | Emerging Cross-Sectional Technologies | 27 | Expired |
| US8184439B2 | Semiconductor module | Electricity | 17 | Active |
| US4700034A | Electromagnetic energy seal of a microwave oven | Electricity | 11 | Expired |
| US9466593B2 | Stack semiconductor package | Electricity | 10 | Active |
| US8524539B2 | Method of manufacturing semiconductor package | Electricity | 8 | Active |
| US11483824B2 | Wireless battery management system, node for wireless communication, and method of transmitting data | Emerging Cross-Sectional Technologies | 7 | Active |
| US9910711B1 | Method and computing device for managing size of thread pool dynamically | Physics | 6 | Active |
| US7626261B2 | Wafer stacked package having vertical heat emission path and method of fabricating the same | Electricity | 5 | Active |
| US6701371B1 | Data transfer method for matching upper protocal layer to high speed serial bus | Electricity | 5 | Expired |
| US8310046B2 | Wafer stacked package waving bertical heat emission path and method of fabricating the same | Electricity | 5 | Active |
| US8049329B2 | Wafer stacked package waving bertical heat emission path and method of fabricating the same | Electricity | 4 | Active |
| US9093443B2 | Tape package and flat panel display device including the same | Electricity | 4 | Active |
| US8344601B2 | Light emitting device | Electricity | 3 | Active |
| US9859263B2 | Semiconductor package | Electricity | 3 | Active |
| US7990568B2 | Apparatus and method for setting printing options using preview image | Physics | 2 | Active |
| US7812445B2 | Semiconductor memory module having an oblique memory chip | Emerging Cross-Sectional Technologies | 2 | Active |
| US8710677B2 | Multi-chip package with a supporting member and method of manufacturing the same | Electricity | 2 | Active |
| US7705449B2 | Cooling apparatus for memory module | Electricity | 2 | Active |
| US7738194B2 | Optical component and method of manufacturing the same | Physics | 2 | Active |
| US10141293B2 | Semiconductor package | Electricity | 1 | Active |
| US8472392B2 | Access point for providing WLAN virtualization, WLAN virtualization system and method of providing access to wireless communication network | Electricity | 1 | Active |
| US9257309B2 | Multi-chip package and method of manufacturing the same | Electricity | 1 | Active |
| US9409485B2 | Apparatus and method for alleviating voltage drop of battery cell | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.