Method of fabricating multilayer printed circuit board
US7707715B2 · kind B2 · utility
9Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Jun 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.