Patent · US Expired

Work carrier and method of processing a workpiece

US7708854B2 · kind B2 · utility

5Cited by

9References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Werner Kroninger · Neutraubling, DE
Gunter Lang · Wernau, DE

Key dates

Filing date	Dec 5, 2003
Grant date	May 4, 2010
Priority date	—
Expiry date	Dec 5, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/249982
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Explained, inter alia, is a method in which a workpiece (52) to be processed is fastened to a work carrier (10) by means of a solid (62). The work carrier (10) is made of a porous material, e.g. of porous ceramic. This processing method permits simple manipulation of the wafer during the processing. In addition, the workpiece (52) can be easily separated from the work carrier (10) using a solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.