Systems and methods for supporting a subset of multiple interface types in a semiconductor device
US7709861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2007 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Mar 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die or substrate with at least two IO buffers. One of the IO buffers is located a distance from a package pin and another of the IO buffers is located another distance from the package pin. One of the IO buffers includes first bond pad electrically coupled to a circuit implementing a first interface type and a floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type. In some cases, the floating bond pad is electrically coupled to the circuit implementing the second interface type via a conductive interconnect, and the floating bond pad is electrically coupled to the package pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.